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High Flow Injection Molding ETFE Granules CAS 25067-11-2 Fluoropolymer Material for Precision Industrial Components

High Flow Injection Molding ETFE Granules CAS 25067-11-2 Fluoropolymer Material for Precision Industrial Components

Brand Name: SHEC
Model Number: SHEC-IM300
MOQ: 200 KG
Price: Contact Us
Payment Terms: L/C, D/A, D/P, T/T
Supply Ability: 2-3 Weeks
Detail Information
Place of Origin:
China
Certification:
ASTM D3159
CAS Number:
25067-11-2
Grade:
Injection Molding
Appearance:
Translucent To White Cylindrical Pellets
Melting Point (°C):
220-270
Tensile Strength (MPa):
≥40
Breaking Elongation (%):
≥320
Volatile Matter (%):
≤0.1
Standard Relative Density:
1.71-1.81
Dielectric Dissipation Factor (10^6 Hz):
≤0.009
Melt Flow Rate (g/10min):
25-45
Mold Shrinkage (%):
1.5-3.0
Processing Temperature (°C):
290-340
HDT At 0.45 MPa (°C):
≥70
Packaging Details:
25 KG/Bag, Inner PE Liner with Outer Woven Bag
Highlight:

High Flow ETFE Granules

,

ETFE Fluoropolymer Material

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Precision Industrial ETFE Granules

Product Description

The SHEC-IM300 Injection Molding Grade ETFE Granules represent a specialized high-flow formulation of ethylene tetrafluoroethylene copolymer (CAS 25067-11-2) tailored for precision injection molding of complex industrial components. Produced in strict compliance with ASTM D3159 quality standards, this grade features an elevated melt flow rate range of 25-45 g/10min, enabling complete and consistent filling of intricate mold cavities with thin-wall sections, fine threaded features, undercuts, and long flow paths. The optimized pellet geometry ensures uniform feeding from standard hopper systems and consistent melt plastication in both reciprocating screw and plunger-type injection molding machines, while the minimal volatile matter content eliminates splay marks, internal voids, and surface defects in finished molded components.

SHEC-IM300 ETFE delivers the full spectrum of fluoropolymer performance advantages in a form factor specifically designed for high-volume injection molding production. Molded components exhibit the same outstanding chemical resistance, broad thermal stability, and excellent mechanical properties characteristic of ETFE while benefiting from the dimensional precision, surface finish quality, and part-to-part consistency that only injection molding can provide. This grade is widely specified by manufacturers of chemical processing equipment, semiconductor fabrication tools, medical device assemblies, aerospace fluid handling components, and electrical interconnection systems who require molded parts that maintain tight tolerances and reliable performance in aggressive chemical and thermal environments where conventional engineering thermoplastics fail prematurely.

Key Features
  • High Flow for Complex Geometries: Elevated melt flow rate (25-45 g/10min at standard load) enables complete filling of molds with thin-wall sections as fine as 0.3 mm, intricate internal threads, multi-cavity tooling, and long flow-length-to-wall-thickness ratios exceeding 200:1, reducing scrap rates and improving production economics for high-value fluoropolymer components.
  • Exceptional Dimensional Stability: Controlled and predictable mold shrinkage (1.5-3.0%) combined with low moisture absorption and high heat deflection temperature (≥70°C at 0.45 MPa) enables molded parts to maintain critical tolerances across varying humidity and temperature conditions, eliminating post-molding dimensional changes that plague nylon and acetal components in demanding applications.
  • Universal Chemical Resistance: The molded ETFE components withstand continuous exposure to concentrated sulfuric acid, hydrochloric acid, nitric acid, sodium hydroxide solutions, chlorinated solvents, aromatic hydrocarbons, and ketones at temperatures up to 150°C, making them the material of choice for valve seats, pump impellers, seal rings, and gaskets in chemical dosing systems, plating lines, and semiconductor wet process tools.
  • High Purity and Low Extractables: With volatile matter content controlled to ≤0.1% and a fully fluorinated polymer backbone free of plasticizers, stabilizers, and processing aids, molded SHEC-IM300 components contribute negligible contamination to ultrapure water, high-purity chemicals, and pharmaceutical process streams, meeting the stringent cleanliness requirements of semiconductor and biopharmaceutical manufacturing.
  • Superior Mechanical Robustness: Tensile strength exceeding 40 MPa and breaking elongation above 320% ensure molded parts withstand mechanical assembly stresses, cyclic pressure loading in valve and pump applications, and impact loads during installation and service without cracking, crazing, or catastrophic brittle failure modes common to less ductile fluoropolymers.
  • Excellent Electrical Insulation: Low dielectric dissipation factor (≤0.009 at 10<sup>6</sup> Hz), high volume resistivity, and outstanding arc tracking resistance make injection molded ETFE connectors, insulators, and terminal blocks ideal for high-voltage electrical equipment, aerospace power distribution systems, and downhole instrumentation operating in conductive fluid environments.
  • Design Flexibility and Aesthetic Finish: The high-flow formulation enables injection molding of parts with polished, mold-reproduced surface finishes ranging from SPI A-1 gloss to VDI 24 matte textures, supporting both functional sealing surfaces requiring low roughness and cosmetic housings where appearance matters, without secondary machining or surface treatment operations.
Technical Specifications
ParameterSpecification
CAS Number25067-11-2
GradeInjection Molding
AppearanceTranslucent to white cylindrical pellets
Melting Point (°C)220-270
Tensile Strength (MPa)≥40
Breaking Elongation (%)≥320
Volatile Matter (%)≤0.1
Standard Relative Density1.71-1.81
Dielectric Dissipation Factor (10^6 Hz)≤0.009
Melt Flow Rate (g/10min)25-45
Mold Shrinkage (%)1.5-3.0
Recommended Processing Temperature (°C)290-340
HDT at 0.45 MPa (°C)≥70
Recommended Mold Temperature (°C)80-140
Applications

The SHEC-IM300 injection molding grade ETFE finds extensive application in the manufacture of precision valve components including ball valve seats, butterfly valve discs, diaphragm valve bodies, and check valve poppets used in chemical processing plants where the molded parts must maintain bubble-tight sealing against aggressive media across thousands of operating cycles. Pump manufacturers mold impellers, volute liners, mechanical seal faces, and lantern rings from this grade for centrifugal pumps, diaphragm metering pumps, and progressing cavity pumps handling corrosive and high-purity fluids in pharmaceutical and semiconductor fabrication facilities. In the electrical and electronics sector, injection molded ETFE connector housings, terminal blocks, coil bobbins, and switch components provide reliable insulation and mechanical protection in aerospace power distribution panels, downhole drilling tool electronics, and military vehicle electrical systems exposed to fuels, lubricants, and de-icing fluids.

Semiconductor equipment manufacturers utilize SHEC-IM300 to mold wafer handling components including cassette guides, process chamber insulators, chemical delivery manifold blocks, and exhaust duct connectors that must resist prolonged exposure to fluorine-based plasma cleaning gases while maintaining dimensional accuracy. Medical device companies injection mold ETFE into endoscopic instrument handles, surgical stapler components, and disposable fluid path connectors requiring repeated autoclave sterilization cycles at 134°C without degradation. In the analytical instrumentation field, molded ETFE flow cells, cuvette holders, and chromatography system fittings provide chemical inertness for ultraviolet-visible spectroscopy and high-performance liquid chromatography applications where sample contamination from leachable plasticizers cannot be tolerated. Water treatment system manufacturers mold ETFE into chemical injection quill nozzles, flow meter bodies, and sampling valve components exposed to sodium hypochlorite, sulfuric acid, and sodium hydroxide dosing solutions.

Packaging & Quality Assurance

SHEC-IM300 injection molding grade ETFE granules are supplied in 25 KG moisture-protective bags with inner PE liners and robust outer woven polypropylene construction designed for international freight handling and extended warehouse storage. Custom packaging configurations including 500 KG bulk fiber drums and 10 KG pilot trial quantities are available to support both initial mold qualification programs and established high-volume production requirements. Every production lot is subjected to a comprehensive quality assurance program that includes melt flow rate determination by ASTM D1238, differential scanning calorimetry for thermal transition characterization, tensile property measurement on injection molded Type I specimens per ASTM D638, mold shrinkage evaluation using a standardized 60 mm x 60 mm x 2 mm plaque mold, and actual injection molding trial assessment on a production-representative multi-cavity test mold. A full Certificate of Analysis is supplied with each shipment. The granules should be stored in a clean, dry warehouse environment at temperatures not exceeding 30°C, protected from direct sunlight, moisture, and sources of contamination. Pre-drying at 120°C for 4 hours using a desiccant dryer with -40°C dew point air is strongly recommended prior to molding to prevent splay and ensure optimal surface finish on molded components. Under recommended storage and handling conditions, the product retains full processability for 24 months from the date of manufacture. Shenhui Technology provides injection molding process support including mold filling simulation consultation, gate and runner design recommendations, processing parameter optimization, and troubleshooting assistance for challenging molding applications.